67SLG100100100PI00

67SLG100100100PI00

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제조업체 부품 67SLG100100100PI00
제조업체 Laird - Performance Materials
설명 METAL FILM OVER FOAM CONTACTS
범주 rf/if 및 rfid
가족 rfi 및 emi - 접점, 핑거스톡 및 개스킷
수명주기: New from this manufacturer.
배달: DHL FedEx Ups TNT EMS
지불 T/T Paypal Visa MoneyGram Western Union
데이터 시트 67SLG100100100PI00 PDF

유효성

재고 55
단가 $ 1.12000

67SLG100100100PI00 Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]

67SLG100100100PI00 명세서

유형 설명
시리즈:SMD Grounding Metallized
패키지:Tape & Reel (TR)Cut Tape (CT)
부품 상태:Active
유형:Film Over Foam
모양:Rectangle
너비:0.394" (10.00mm)
길이:0.394" (10.00mm)
키:0.394" (10.00mm)
재료:Polyurethane Foam, Tin-Copper Polyester (SN/CU)
도금:-
도금 - 두께:-
부착 방법:Solder
작동 온도:-40°C ~ 70°C

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

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